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US 2006/0038288 A1Published application
Substrate with many via contact means disposed therein
AssigneeTecnisco, Ltd.
InventorsHokichi Yoshioka, Kazuhiko Ito
Life of this patent
Estimating the term…
Abstract
A substrate having many via contact means disposed therein. Each of the via contact means is composed of a via hole, as a through-hole, formed in the substrate, a metal film disposed on the inner peripheral surface of the via hole, and a solder filled into the cavity defined by the metal film.
Claims12
A substrate having many via contact means disposed therein, and wherein each of the via contact means is composed of a via hole, as a through-hole, formed in the substrate, a metal film disposed on an inner peripheral surface of the via hole, and a solder filled into a cavity defined by the metal film.
Dependencies are inferred from the claim text.