Package, method for producing a package and a device for producing a package
OwnerJohan Maier, Karl Kronegger +2inventors
InventorsJohan Maier, Karl Kronegger, Gottfried Reiter, Harald Kraushaar
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Abstract
The invention relates to a package or package raw material comprising an electrically conductive layer arranged on a base material and a chip connected to the electrically conductive layer, the electrically conductive layer being configured as an antenna element for transferring data and/or energy, wherein the electrically conductive layer comprises a non-conductive portion. Further, the invention relates to a method for producing a package and a device for producing a package.
Claims22
Package or package raw material comprising an electrically conductive layer (3) arranged on a base material (2), characterized by a chip (5) connected to the electrically conductive layer (3), wherein the electrically conductive layer (3) is configured as an antenna element for transferring data and/or energy and comprises at least one non-conductive portion (4).
Method for producing a package or package raw material comprising an electrically conductive layer (3) arranged on a base material (2), comprising the steps of:
- a) applying a metal material on the base material (2) for providing the electrically conductive layer (3),
- b) removing metal material of the electrically conductive layer (3) for providing at least one non-conductive portion (4) in the electrically conductive layer (3), and
- c) fixing a chip (5) to the electrically conductive layer (3), preferably by means of a conductive adhesive.
Method for producing a package or package raw material comprising an electrically conductive layer (3) arranged on a base material (2), comprising the steps of:
- a removing metal material of an electrically conductive film (3) for providing at least one non-conductive portion (4) in the electrically conductive film (3),
- b applying the electrically conductive film (3) with the at least one non-conductive portion (4) on the base material (2) for providing the electrically conductive layer (3),and
- c) fixing a chip (5) to the electrically conductive layer (3), preferably by means of a conductive adhesive.
Device for producing a package or package raw material, comprising means for applying a electrically conductive layer (3) on a base material (2), characterized by means for partly removing the electrically conductive layer (3) from the base material (2) or means for removing parts of a metal film that forms the electrically conductive layer (3) before being applied to the base material (2) for forming at least one non-conductive portion (4).
Dependencies are inferred from the claim text.