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US 2006/0038282 A1Published application
Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages
AssigneeTexas Instruments Incorporated
InventorBernhard Lange
Life of this patent
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Abstract
A semiconductor package comprising a die adjacent a lead frame die pad, said lead frame die pad adapted to dissipate heat from the die. The package further comprises a thermally-conductive material abutting the die and a heatsink abutting the thermally-conductive material, said heatsink facing a direction opposite from the lead frame die pad.
Claims21
A semiconductor package, comprising:
- a die adjacent a lead frame die pad, said lead frame die pad adapted to dissipate heat from the die;
- a thermally-conductive material abutting the die;
- and
- a heatsink abutting the thermally-conductive material on an opposite side of said die from said lead frame die pad.
1 more element
A method, comprising:
- depositing a thermally-conductive material on a die adjacent a package lead frame;
- coupling a heatsink to the die on a side of the die opposite said package lead frame, the thermally-conductive material sandwiched between the heatsink and the die, said heatsink facing away from the lead frame;
- and
- depositing a mold compound adjacent the die.
1 more element
An apparatus, comprising:
- a plurality of heatsinks, at least one of said heatsinks adapted to couple to a thermally-conductive material abutting a die on a semiconductor wafer;
- and
- an aperture between at least some of the heatsinks, said aperture adapted to facilitate the deposition of a mold compound.
Dependencies are inferred from the claim text.