Methods and systems for attaching die in stacked-die packages
OwnerRahul Manepalli, Shinobu Kourakata +1inventors
InventorsRahul Manepalli, Shinobu Kourakata, Nina Ricci Buenaseda
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Abstract
A method for producing a multiple-die device by attaching a die to a substrate using a first die-attach material having a first processing temperature and attaching a subsequent die using a second die-attach material having a second processing temperature such that the process of attaching the second die does not degrade the first die-attach material. For one embodiment, multiple dies are attached using each die-attach material. For one embodiment, the first die-attach material is a thermoplastic film and the second and subsequent die-attach materials are reformulations of the thermoplastic film.
Claims10
1-17. (canceled)
A method comprising:
- selecting a first die-attach material having a first associated processing temperature;
- attaching a first set of one or more dies to a substrate and to one another using the first die-attach material;
- selecting a second die-attach material having a second associated processing temperature, the second associated processing temperature being lower than the first associated processing temperature such that subjecting the first die-attach material to the second associated processing temperature does not degrade the first die-attach material to within a specified degree;
- and
- attaching a second set of one or more dies to the first set of one or more dies and to one another using the second die-attach material.
26-30. (canceled)
Dependencies are inferred from the claim text.