3D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modules

A method for manufacturing a 3D circuit module comprising:

• forming a support member having a frame in a periphery thereof and a recess;
• forming a coating layer made of resin material which is adhesive and has a softening temperature lower than a softening temperature of the support member in such a manner as to coat the frame and filling in the recess;
• forming, on the coating layer, a wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land;
• mounting an electronic component on the coating layer in such a manner that a projecting electrode formed on a side of the electronic component is connected to the second land;
• and
• pressing the electronic component mounted on the coating layer into the coating layer in the recess under a temperature of not less than the softening temperature of the resin material and a predetermined pressure.

A method for manufacturing a 3D circuit module comprising:

• forming a support member having a frame in a periphery thereof and a recess;
• forming a wiring pattern, which includes a first land on the frame, a second land on the recess and a wiring part for connecting between the first land and the second land, on a coating sheet coating at least the frame and the recess and made of resin material which is adhesive and has a softening temperature lower than a softening temperature of the support member, and then mounting an electronic component on the coating sheet in such a manner that a projecting electrode formed on a side of the electronic component is connected to the second land;
• placing the coating sheet mounted with the electronic component onto the support member in such a manner as to position the first land on the frame, and to position the second land and the electronic component in the recess;
• and
• pressing the coating sheet and the electronic component together into the recess under a temperature of not less than the softening temperature of the resin material and a predetermined pressure.

A mobile terminal device mounted with a 3D circuit module, the 3D circuit module comprising:

• a support member having a frame in a periphery thereof and a recess;
• a coating layer for coating the frame and filling in the recess, the coating layer being made of resin material which is adhesive and has a softening temperature lower than a softening temperature of the support member;
• a wiring pattern formed on the coating layer, the wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land;
• and
• an electronic component having a projecting electrode formed on a side thereof, the electronic component being bonded to the coating layer and accommodated in the recess, with the projecting electrode connected to the second land.