Printed circuit board

Abstract

To provide a printed circuit board in which two wiring patterns having a width of 0.15 mm, which are to be passed through the area of the printed circuit board for mounting a 1608-size chip component, are formed by printing, thereby increasing the circuit packaging density, reducing the production cost and suppressing the yield reduction. In a range in which the distance between two lands 12 to which a surface-mount chip component is electrically connected (the distance between points 17a and 17b) allows formation of two wiring patterns having a line width of 0.25 mm (the distance is equal to or more than 1.25 mm), wiring patterns 15 and 16 having a line width of 0.25 mm are formed. In this way, parts of the wiring patterns having a line width of 0.15 mm (narrow parts 15a and 16a) are minimized, and thus, the reduction in production yield is suppressed.

Dependencies are inferred from the claim text.