Semiconductor device and method of producing the same
AssigneeOki Electric Industry Co., Ltd.
InventorMakoto Terui
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Abstract
A semiconductor device of a wafer level chip size package type is formed by cutting a semiconductor wafer with a plurality of semiconductor elements formed thereon in pieces. The semiconductor device includes a semiconductor substrate as the semiconductor wafer having a magnetic layer formed on at least one of a front surface and a backside surface of the semiconductor wafer.
Claims16
A semiconductor device of a wafer level chip size package type to be formed by cutting into pieces a semiconductor wafer with a plurality of semiconductor elements formed thereon, comprising:
- a semiconductor substrate formed of the semiconductor wafer, and
- a magnetic layer formed on at least one of a front surface and a backside surface of the semiconductor substrate.
A method of producing a semiconductor device, comprising the steps of:
- preparing a semiconductor wafer with a plurality of semiconductor elements formed thereon,
- forming a magnetic layer on at least one of a front surface and a backside surface of the semiconductor wafer, and
- cutting the semiconductor wafer into pieces along a cutting line to form the semiconductor device.
Dependencies are inferred from the claim text.