Hermetically sealed packages and their method of manufacture

Abstract

A device includes a temperature-sensitive material disposed between a first substrate and a second substrate. A metal-containing seal is disposed perimetrically between the first and second substrates. In addition, a method of forming a device includes providing a temperature-sensitive material between a first substrate and a second substrate. The method also includes applying an electromagnetic field, which inductively heats a metal-containing material that is disposed between the first and second substrates without heating the temperature sensitive material to a temperature greater than a threshold temperature.

Dependencies are inferred from the claim text.