Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers
AssigneeMicron Technology, Inc.
InventorSteven Oliver
Life of this patent
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Abstract
Microelectronic imagers with curved image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imager die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imager die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.
Claims76
A microelectronic imager device, comprising:
- an imager die having a substrate, a microelectronic image sensor having a face with a convex and/or concave contoured portion at one side of the substrate, integrated circuitry in the substrate operatively connected to the image sensor, and external contacts electrically coupled to the integrated circuitry;
- and
- a cover over the face of the image sensor.
The imager of claim 6 wherein the fluid in the compartment is at a lower pressure than an ambient pressure to draw the substrate into the compartment such that the face of the image sensor has a concave contour.
A microelectronic imager device, comprising:
- an imager die having a substrate with a bowed portion, a microelectronic image sensor at the bowed portion of the substrate, and integrated circuitry electrically coupled to the image sensor;
- and
- a cover over the image sensor.
A microelectronic imager die comprising:
- a substrate;
- a microelectronic image sensor at one side of the substrate, the microelectronic image sensor having a face for receiving radiation;
- integrated circuitry electrically coupled to the image sensor;
- and
- a flexor unit that bends a portion of the substrate and the image sensor.
A microelectronic workpiece, comprising:
- a substrate having a plurality of imager dies, wherein individual imager dies include an image sensor having a curved face and integrated circuitry operatively coupled to the image sensor;
- and
- a cover over the substrate.
A microelectronic workpiece, comprising:
- a substrate having a plurality of bowed regions and imager dies at the bowed regions, wherein individual imager dies include an image sensor having a curved face at a corresponding bowed region and an integrated circuit operatively coupled to the image sensor;
- and
- a cover over the substrate.
A method of manufacturing a microelectronic imager device, comprising:
- constructing an imager die having a substrate, integrated circuitry in the substrate, and an image sensor having a curved face at one side of the substrate;
- and
- positioning a cover over the substrate.
A method of manufacturing a microelectronic imager device, comprising:
- providing a substrate having an imager die with an image sensor at one side of the substrate and an integrated circuit operatively coupled to the image sensor;
- positioning a cover over the image sensor;
- and
- bending the substrate and the imager die to bend the image sensor.
A method of manufacturing microelectronic imager devices, comprising:
- forming a plurality imager dies on a substrate, wherein individual imager dies include a microelectronic image sensor and an integrated circuit electrically coupled to the image sensor;
- and
- bowing discrete regions of the substrate at the image sensors to bend the image sensors.
Dependencies are inferred from the claim text.