Infrared sensor device and its manufacturing method
AssigneeDenso Corporation
InventorKazuaki Watanabe
Life of this patent
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Abstract
An infrared sensor device includes an infrared sensor element in which a membrane is formed on a surface side of a substrate by forming a concave portion on a rear face side of the substrate, and electrodes for detection are arranged on the surface side of the substrate, and an infrared ray absorbing film for absorbing the energy of an infrared ray by receiving the infrared ray is arranged at the membrane on the rear face side of said substrate. The substrate is electrically connected to a circuit substrate through a bump in a state in which the surface side of the substrate is opposed to the circuit substrate.
Claims5
An infrared sensor device comprising:
- an infrared sensor element in which a membrane as a thin wall portion is formed on a surface side of a substrate by forming a concave portion on a rear face side of the substrate, and electrodes for detection are arranged on the surface side of the substrate, and an infrared ray absorbing film for absorbing the energy of an infrared ray by receiving the infrared ray is arranged at the membrane on the rear face side of said substrate;
- and
- a circuit substrate for mounting the infrared sensor element,
- wherein the substrate is electrically connected to the circuit substrate through a bump in a state in which the surface side of the substrate is opposed to the circuit substrate.
An infrared sensor device comprising:
- a sensor element comprising a membrane formed by a concave portion in a substrate, an infrared absorbing film disposed on a first surface of the substrate that is in the concave portion, a plurality of detection electrodes disposed on a second surface of the substrate that is not in the concave portion;
- and
- a circuit substrate for mounting the infrared sensor element, wherein the substrate is electrically connected to the circuit substrate through a bump in a state in which the second surface of the substrate faces the circuit substrate.
Dependencies are inferred from the claim text.