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US 2006/0037997 A1Published application
Joining apparatus and method
AssigneePanasonic Corporation
InventorsKazushi Higashi, Tatsuo Sasaoka, Shinji Ishitani
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AssigneePanasonic Corporation
InventorsKazushi Higashi, Tatsuo Sasaoka, Shinji Ishitani
Estimating the term…
The joining apparatus includes a suction nozzle for holding an electronic component, a board stage for holding a circuit board in opposition to the electronic component, and an excimer ultraviolet lamp placed at an irradiation position between the positioned electronic component and circuit board. In such a joining apparatus, ultraviolet irradiation to Au bumps of the electronic component and ultraviolet irradiation to board electrodes of the circuit board are performed concurrently by the excimer ultraviolet lamp to execute cleaning process of the two metallic portions. Thereafter, ultrasonic vibrations are imparted to the two metallic portions while those metallic portions are kept in contact with each other, by which metal joining between the two metallic portions is fulfilled.
A joining apparatus comprising:
A joining method for joining a first metallic portion of a first object and a second metallic portion of a second object to each other, comprising:
A joining method for joining a first metallic portion of a first object and a second metallic portion of a second object to each other, comprising:
Dependencies are inferred from the claim text.