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US 2006/0037995 A1Published application
Heatslug to leadframe attachment
AssigneeTexas Instruments Incorporated
InventorBernhard Lange
Life of this patent
Estimating the term…
Abstract
A method for coupling a heat slug to a lead frame, comprising aligning a heat slug and a lead frame depositing a material between the heat slug and the lead frame, and clamping together the heat slug and the lead frame.
Claims17
A method for coupling a heat slug to a lead frame, comprising:
- aligning a heat slug and a lead frame;
- depositing a material between the heat slug and the lead frame;
- and
- clamping together the heat slug and the lead frame.
1 more element
A semiconductor apparatus, comprising:
- a heat slug;
- a lead frame adjacent said heat slug;
- multiple clamps, each clamp coupled to the heat slug and the lead frame;
- and
- a material sandwiched between the heat slug and the lead frame.
2 more elements
A method, comprising:
- a step for aligning a heat slug and a lead frame;
- a step for depositing a material between the heat slug and the lead frame;
- and
- a step for holding together the heat slug and the lead frame.
1 more element
Dependencies are inferred from the claim text.