Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body
AssigneeFujitsu Limited
InventorsHideshi Tokuhira, Hiroaki Date, Hiroki Uchida, Minoru Ishinabe
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AssigneeFujitsu Limited
InventorsHideshi Tokuhira, Hiroaki Date, Hiroki Uchida, Minoru Ishinabe
Estimating the term…
A pattern is formed with an insulative resin on a bonding face of a silicon chip, which is a heat generating element, and a pattern is formed with the insulative resin on a bonding face of a heat sink, which is a heat dissipating element, in alignment with the insulative resin parts formed on the silicon chip. The silicon chip and the heat sink are bonded to each other via a heat transfer sheet. The silicon chip and the heat sink are bonded to each other by a metal to form metal connection portions in a region where no insulative resin parts are formed, while the silicon ship and the heat sink are bonded to each other by a resin to form resin connection portions in a region where the insulative resin parts are formed.
A heat transfer sheet provided between a heat generating element and a heat dissipating element to transfer heat from the heat generating element to the heat dissipating element, wherein
A heat transfer structural body comprising:
A method for manufacturing a heat transfer structural body comprising a heat generating element, a heat dissipating element, and a heat transfer sheet bonded between the heat generating element and the heat dissipating element to thereby transfer heat from the heat generating element to the heat dissipating element, the method comprising the steps of:
Dependencies are inferred from the claim text.