Heat dissipation apparatus and vapor chamber thereof
AssigneeDelta Electronics, Inc.
InventorsYency Chen, Chi-Feng Lin, Chin-Ming Chen
Life of this patent
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AssigneeDelta Electronics, Inc.
InventorsYency Chen, Chi-Feng Lin, Chin-Ming Chen
Estimating the term…
A heat dissipation apparatus and a vapor chamber thereof. The heat dissipation apparatus comprises a heat sink and a vapor chamber for dissipating heat from a heat source of an electric device. The vapor chamber comprises a heat-absorption region, a heat-dissipation region, a working fluid, a wick structure and at least one buffer region. The working fluid in the heat-absorption region is vaporized while absorbing heat in the heat-absorption region from the heat source, and the vaporized working fluid condenses in the heat-dissipation region after latent heat thereof is released. The capillarity of the wick structure drives the working fluid returning to the heat-absorption region from the heat-dissipation region, and the buffer regions include a reservoir for accessing the working fluid. The heat-dissipation apparatus equipped with a vapor chamber having buffer regions can reduce entire weight and shorten distance during heat conduction so that heat dissipation efficiency is increased.
A vapor chamber used for transferring heat from a heat source to a heat sink, comprising:
A heat dissipation apparatus applied to a heat-generating electronic element, comprising:
Dependencies are inferred from the claim text.