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US 2006/0037735 A1Published application
Bi-level heat sink
OwnerMatthew Connorsinventor
Life of this patent
Estimating the term…
Abstract
A bi-level assembly comprises a heat sink, a processor and a power supply. The heat sink includes a base and at least one fin structure attached to the base. The base may be a plate with attached heat pipes or the base may be a vapor chamber. The base is connected to the top of the processor and power supply and has an s-bend to accommodate the differing heights of the processor and power supply. Heat from the higher heat generating processor may be transferred by the base and dissipated by the fins above the power supply.
Claims6
1-17. (canceled)
A circuit board assembly, comprising:
- a printed circuit board including a substrate with wirings printed thereon;
- a processor mounted to the printed circuit board, the processor having a first height;
- a component mounted to the printed circuit board next to the processor, the component being a heat source, the component having a second height different from the first height;
- and
- a heat sink including a base and at least one fin structure, wherein:
- the base of the heat sink is continuous and has a first side abutting the component and the processor,
- the base has an offset between the processor and component, and
- the at least one fin structure is attached to a second side of the base opposite the first side wherein a first portion of said at least one fin structure has a first height and a second portion of said at least one fin structure has a second height as measured from a bottom of each respective fin within said fin structure to a top of each respective fin within said fin structure.
5 more elements
A heat sink comprising:
- a first base portion having a first side and a second side, said first side defining an open channel for receiving a portion of two heat pipes;
- a second base portion having a first side and a second side, said first side of said second base defining an open channel corresponding to said open channel in said first base portion and each receiving a corresponding portion of said two heat pipes;
- an offset located between said first base portion and said second base portion so that (i) said first side of said first base portion is lower than said first side of said second base portion and (ii) said second side of said first base portion is lower than said second side of said second base portion, said offset including a portion of said open channel defining an opening that exposes at least one of said two heat pipes;
- and
- a fin structure positioned upon said second side of said first base portion and said second base portion wherein a top of said fin structure located on said second side of said first base portion is substantially coplanar with a top of said fin structure on said second base portion.
2 more elements
A heat sink comprising:
- a first base portion having a first side and a second side, said first side defining an open channel for receiving a portion of two heat pipes;
- a second base portion having a first side and a second side, said first side of said second base defining an open channel corresponding to said open channel in said first base portion and each receiving a corresponding portion of said two heat pipes;
- an offset located between said first base portion and said second base portion so that (i) said first side of said first base portion is lower than said first side of said second base portion and (ii) said second side of said first base portion is lower than said second side of said second base portion, said offset including a portion of said open channel defining an opening that exposes at least one of said two heat pipes;
- and
- a fin structure positioned upon said second side of said first base portion and said second base portion wherein a top of said fin structure located on said second side of said first base portion is off-set from a top of said fin structure on said second base portion.
2 more elements
Dependencies are inferred from the claim text.