Method for making an impact detector

Abstract

A process for making an impactor detector involves steps of fabricating a semiconductive seismic mass layer; fabricating a seimconductive substrate having a recess in a surface thereof; fixing the seismic layer to the surface of the substrate so that the seismic mass layer covers the recess; etching a portion of the seismic mass layer overlying the recess to form a seismic mass that is supported over the recess by a beam; printing an electrically conductive circuit on the seismic mass and on the substrate, the printed circuits allowing an electrostatic force to be applied between the seismic mass and the substrate; and fixing a cap over the seismic mass to define a sealed cavity enclosing the seismic mass between the recess and the cap. The process provides an improved impact detector that is reliable and may be fabricated at a lower cost as compared with conventional processes and designs.

Dependencies are inferred from the claim text.