Printed wiring board without traces on surface layers enabling PWB's without solder resist

A method to fabricate a printed wiring board comprising:

• providing a dielectric substrate comprising multiple dielectric layers;
• said substrate having first and second surface layers, and
• forming on a top surface layer of said substrate a plurality of circuit attachment pads;
• where all interconnections of said printed wiring board are located beneath the surface layers within the dielectric substrate to electrically interconnect said plurality of circuit attachment pads.

A printed wiring board comprising:

• a dielectric substrate, said substrate having first and second surface layers, at least one of said surface layers comprising circuit attachment pads;
• and
• a plurality of electrically conductive interconnections within said dielectric substrate;
• wherein all of said interconnections are disposed beneath the surface layers and within the dielectric substrate.

A printed wiring board comprising:

• a dielectric substrate comprising multiple dielectric layers, said substrate having first and second surface layers, at least one of said surface layer comprising circuit attachment pads;
• and
• a plurality of electrically conductive interconnections on said dielectric substrate;
• wherein all of said interconnections are disposed beneath the surface layers;
• and
• at least one electrical component electrically coupled to said circuit attachment pads.