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US 2006/0033217 A1Published application
Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same
OwnerBrian Taggart, Robert Nickerson +1inventors
InventorsBrian Taggart, Robert Nickerson, Ronald Spreitzer
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Abstract
A flip-chip is mounted on a flex substrate. A flip-chip is mounted on a flex substrate, and a wire-bond chip is mounted on the flip-chip. A packaged flip-chip die is coupled to the flex substrate. A computing system is also disclosed that includes the flip-chip on a flex substrate configuration.
Claims27
An article comprising:
- a first die, wherein the first die is a flip-chip disposed on a flex substrate.
An article comprising:
- a first die including an active surface and a backside surface, wherein the first die is flip-chip disposed on a rigid substrate;
- and
- a second die disposed above the first die, wherein the second die is wire-bonded to the rigid substrate.
A computing system comprising:
- a first die, wherein the first die is flip-chip disposed on a flex substrate;
- and
- at least one of an input device and an output device coupled to the first die.
A process comprising:
- flip-chip bonding a first die to a flex substrate.
Dependencies are inferred from the claim text.