Power gridding scheme
OwnerKrishna Seshaninventor
Life of this patent
Estimating the term…
Abstract
An electrical device includes electrical contact pads, a supply voltage bus and an interconnection circuit. The electrical contact pads receive a supply voltage, and the bus is electrically connected to the electrical contact pads. For each electrical contact pad, the interconnection circuit forms a redundant connection between the bus and the electrical contact pad. The electrical device may include a passivation layer that includes windows to establish electrical contact between the electrical contact pads and the supply voltage bus. This window may be elongated in a path that is generally aligned with the path along which the supply voltage bus extends.
Claims8
1-19. (canceled)
A method usable with a semiconductor device, comprising:
- electrical connecting external contacts of a semiconductor device to internal buses of the semiconductor device;
- establishing redundant connections between the buses and the external contacts.
21-24. (canceled)
A method usable with a semiconductor device, comprising:
- electrical connecting external contacts of a semiconductor device to internal buses of the semiconductor device;
- establishing redundant connections between the buses and the external contacts;
- forming a passivation layer;
- providing contacts that are exposed for external connections with the semiconductor device on one side of the passivation layer;
- and
- forming the redundant connections on said one side.
Dependencies are inferred from the claim text.