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US 2006/0033210 A1Published application
Fine pitch low-cost flip chip substrate
AssigneeTexas Instruments Incorporated
InventorsSatyendra Chauhan, Masood Murtuza
Life of this patent
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Abstract
A package is disclosed, which includes a substrate, a solder masker, and a first aperture through the solder mask. The substrate has a surface on which metal traces are formed. The solder mask covers at least a portion of the surface of the substrate. And the first aperture through the solder mask exposes a plurality of the metal traces.
Claims11
1-3. (canceled)
The package of claim 5, wherein the first aperture and the second aperture are approximately 105 micrometers apart.
A package, comprising:
- a substrate having a surface comprising metal traces:
- a solder mask covering a portion of the surface of the substrate;
- a first and a second substantially rectangular apertures through the solder mask, each aperture having a width, uncovering a plurality of metal traces;
- and
- a first solder bump on a first metal trace in the first aperture but not on a adjacent metal trace and a second solder bump on the adjacent metal trace in the second aperture but not on the first metal trace.
2 more elements
A package, comprising:
- a substrate having a surface comprising metal traces;
- a solder mask covering a portion of the surface of the substrate;
- a first and a second apertures through the solder mask, each aperture having a width, uncovering a plurality of metal traces:
- a first solder bump on a first metal trace in the first aperture;
- a second solder bump on a second metal trace in the first aperture;
- and
- a single metal trace between the first and second metal traces, said single metal trace not having a solder bump in the first aperture.
4 more elements
Dependencies are inferred from the claim text.