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US 2006/0033209 A1Published application
Hybrid integrated circuit device
AssigneeSanyo Electric Co., Ltd.
InventorsJunichi Iimura, Katsumi Okawa, Yasuhiro Koike, Hidefumi Saito
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Abstract
In a molding process, a hybrid integrated circuit substrate is fixed the position of the substrate in a thickness direction. A leadframe is connected, with an upward inclination, to a hybrid integrated circuit substrate and transported into a mold cavity. By horizontally fixing the leadframe by mold dies, the hybrid integrated circuit substrate inclined upward is urged downward by a pushpin. This can fix the position of the hybrid integrated circuit substrate within the mold cavity and integrally transfer-molded.
Claims6
A hybrid integrated circuit device comprising:
- a hybrid integrated circuit substrate;
- a lead fixed on the hybrid integrated circuit substrate;
- and
- a resin seal body transfer-molding the substrate and the lead;
- wherein the substrate includes a region on which a pushpin for fixing the substrate is to urge during transfer molding.
2 more elements
6-17. (canceled)
Dependencies are inferred from the claim text.