Microwave-monolithic-integrated-circuit-mounted substrate, transmitter device for transmission only and transceiver device for transmission/reception in microwave-band communication

Abstract

An MMIC (Microwave Monolithic Integrated Circuit)-mounted substrate includes a double-metal-foil dielectric substrate having a dielectric substrate with a metal foil pattern formed on both sides of the substrate, an MMIC that is a surface-mount high power amplifier mounted on one side of the double-metal-foil dielectric substrate, and a metal chassis attached to the other side of the double-metal-foil dielectric substrate. The double-metal-foil dielectric substrate has a plurality of through holes. A copper foil pattern that is a metal foil pattern continuously extends to cover the inner surfaces of the through holes and both sides of the dielectric substrate, and solder is buried in the through holes.

Dependencies are inferred from the claim text.