Liquid metal thermal interface for an integrated circuit device
AssigneeIntel Corporation
InventorsIoan Sauciuc, Gregory Chrysler
Life of this patent
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Abstract
A liquid metal thermal interface for an integrated circuit die. The liquid metal thermal interface may be disposed between the die and another heat transfer element, such as a heat spreader or heat sink. The liquid metal thermal interface includes a liquid metal in fluid communication with a surface of the die, and liquid metal moving over the die surface transfers heat from the die to the heat transfer element. A surface of the heat transfer element may also be in fluid communication with the liquid metal. Other embodiments are described and claimed.
Claims33
A thermal interface comprising a liquid metal in fluid communication with a surface of an integrated circuit die, the liquid metal to move over the die surface and transfer heat from the die to a heat transfer element.
A device comprising:
- an integrated circuit die having a surface;
- a heat transfer element;
- and
- a thermal interface disposed between the die and the heat transfer element, the thermal interface including a liquid metal in fluid communication with the die surface, the liquid metal to move over the die surface and transfer heat from the die to the heat transfer element.
An apparatus comprising:
- a fluid camber having an inlet and an outlet, wherein a wall of the fluid chamber is defined by a surface of an integrated circuit die and an opposing wall of the fluid chamber is thermally coupled with a heat transfer element;
- a fluid actuator coupled with the inlet;
- a fluid conduit extending between the outlet and the fluid actuator, wherein the fluid chamber, fluid actuator, and fluid conduit provide a fluid circuit;
- and
- a quantity of a liquid metal disposed within the fluid circuit, the fluid actuator to circulate the liquid metal through the fluid circuit;
- wherein the liquid metal flowing through the chamber transfers heat from the die to the heat transfer element.
A method comprising:
- coupling a fluid circuit with an integrated circuit die, wherein a surface of the die is in fluid communication with the fluid circuit;
- thermally coupling a heat transfer element with the fluid circuit, wherein a thermal interface region is formed between the die surface and the heat transfer element;
- coupling a fluid actuator with the fluid circuit;
- and
- disposing a quantity of a liquid metal in the fluid circuit, the fluid actuator to circulate the liquid metal within the fluid circuit and through the thermal interface region.
A method comprising:
- moving a liquid metal through an interface region between a surface of an integrated circuit die and a heat transfer element, the liquid metal in fluid communication with the die surface;
- wherein the liquid metal flowing through the interface region transfers heat from the integrated circuit die to the heat transfer element.
A system comprising:
- a memory;
- and
- a processing device coupled with the memory, the processing device including
- an integrated circuit die having a surface,
- a heat transfer element, and
- a thermal interface disposed between the die and the heat transfer element, the thermal interface including a liquid metal in fluid communication with the die surface, the liquid metal to move over the die surface and transfer heat from the die to the heat transfer element.
Dependencies are inferred from the claim text.