Systems and methods for wafer bonding by localized induction heating
AssigneeHewlett-Packard Development Company, L.P.
InventorsJames McKinnell, Chien-Hua Chen, John Liebeskind, Ronald Hellekson
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Abstract
A system and method bond wafers using localized induction heating. One or more induction micro-heaters are formed with a first substrate to be bonded. A second substrate is positioned in intimate contact with the induction micro-heaters. An alternating magnetic field is generated to induce a current in the induction micro-heaters, to form one or more bonds between the first substrate and the second substrate.
Claims24
A method for wafer bonding using localized induction heating, comprising:
- forming one or more induction micro-heaters with a first substrate to be bonded;
- positioning a second substrate in intimate contact with the induction micro-heaters;
- and
- generating a first alternating magnetic field to induce current in the induction micro-heaters, to form one or more bonds between the first substrate and the second substrate.
A method for wafer bonding using localized induction heating, comprising:
- depositing one or more first induction micro-heaters on a first surface of a first substrate to be bonded;
- depositing one or more second induction micro-heaters on a second surface of a second substrate to be bonded;
- positioning the first and second substrates such that the first and second induction micro-heaters are in intimate contact and the first and second micro-heaters are aligned;
- and
- generating one or more alternating magnetic fields to induce current in the first and second induction micro-heaters, to generate heat to form one or more bonds between the first substrate and the second substrate.
A package for encapsulating a device, formed by:
- disposing one or more induction micro-heaters on a surface of a first substrate to be bonded;
- positioning a second substrate in intimate contact with the induction micro-heaters;
- and
- generating at least one alternating magnetic field to induce current in the induction micro-heaters, to form one or more bonds between the first substrate and the second substrate such that a chamber encapsulates the device.
A system for wafer bonding by localized induction heating, comprising:
- one or more coils for generating one or more alternating magnetic fields;
- and
- a package having (a) a device, (b) first and second substrates, and (c) at least one induction micro-heater disposed between the first and second substrates, the induction micro-heater being responsive to the alternating magnetic fields to generate heat and form a bond between the first and second substrates.
The system of claim 29, further comprising a power supply to drive the coils.
A method for wafer bonding by localized induction heating, comprising:
- forming a plurality of induction micro-heaters with a first substrate to be bonded;
- positioning a second substrate in intimate contact with the induction micro-heaters;
- and
- generating a plurality of alternating magnetic fields to induce current in the induction micro-heaters, to form one or more bonds between the first substrate and the second substrate.
Dependencies are inferred from the claim text.