Ceramic package, assembled substrate, and manufacturing method therefor
AssigneeSanyo Electric Co., Ltd.
InventorsNatsuyo Nagano, Takashi Ogura, Masanori Hongo, Masami Fukuyama
Life of this patent
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Abstract
In a ceramic package including one or more ceramic layers and being capable of having an electronic component and a lid fixed to a surface thereof, a surface of a ceramic layer having a sealing electrode for joining the lid through a sealing member and a pad to be connected to input and output electrodes and/or a ground electrode of the electronic component is divided into an inner portion having the pad and an outer portion having the sealing electrode with a stepped side wall as a border for preventing the sealing member from flowing, and one of the inner portion and the outer portion projects relative to the other.
Claims6
A ceramic package comprising one or more ceramic layers and being capable of having an electronic component and a lid fixed to a surface thereof, wherein a surface of a ceramic layer having a pad to be connected to input and output electrodes and/or a ground electrode of the electronic component is divided into an inner portion having the pad and an outer portion with a stepped side wall as a border for preventing a sealing member from flowing, and one of the inner portion and the outer portion projects relative to the other.
A manufacturing method for a ceramic package in which a ceramic layer has a surface provided with an inner portion and an outer portion with a stepped side wall as a border, and one of the inner portion and the outer portion projects relative to the other, the manufacturing method for the ceramic package comprising the steps of:
- preparing a step-forming mask having a recess corresponding to either the inner portion or the outer portion to be projected, the recess having a generally flat bottom surface;
- positioning and fixing the step-forming mask on a non-pressed body having one or more green sheets positioned;
- and
- vacuum-packing the body to obtain a vacuum-packed body, and thereafter applying hydrostatic pressure to integrate the vacuum-packed body.
A manufacturing method for a ceramic package assembled substrate having connected two-dimensionally ceramic package parts to be a ceramic package in which a ceramic layer has a surface provided with an inner portion and an outer portion with a stepped side wall as a border, and one of the inner portion and the outer portion projects relative to the other, the manufacturing method for the ceramic package assembled substrate comprising the steps of:
- preparing a step-forming mask having a recess corresponding to either the inner portion or the outer portion to be projected, the recess having a generally flat bottom surface;
- positioning and fixing the step-forming mask on a non-pressed body having one or more green sheets positioned;
- and
- vacuum-packing the body to obtain a vacuum-packed body, and thereafter applying hydrostatic pressure to integrate the vacuum-packed body.
Dependencies are inferred from the claim text.