Power gridding scheme
AssigneeIntel Corporation
InventorKrishna Seshan
Life of this patent
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Abstract
An electrical device includes electrical contact pads, a supply voltage bus and an interconnection circuit. The electrical contact pads receive a supply voltage, and the bus is electrically connected to the electrical contact pads. For each electrical contact pad, the interconnection circuit forms a redundant connection between the bus and the electrical contact pad. The electrical device may include a passivation layer that includes windows to establish electrical contact between the electrical contact pads and the supply voltage bus. This window may be elongated in a path that is generally aligned with the path along which the supply voltage bus extends.
Claims32
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An electrical device comprising:
- electrical contact pads to receive a supply voltage;
- a power bus electrically connected to the electrical contact pads;
- and
- an interconnection circuit to, for each electrical contact pad, form a redundant connection between the bus and the electrical contact pad.
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An electrical device comprising:
- electrical contact pads to receive a supply voltage;
- a power bus electrically connected to the electrical contact pads;
- and
- an interconnection circuit to, for each electrical contact pad, form a redundant connection between the bus and the electrical contact pad,
- wherein the electrical device comprises a semiconductor device comprising having multiple process layers, and
- the interconnection circuit is formed in the same process layer as the power bus.
A method usable with a semiconductor device, comprising:
- electrical connecting external contacts of a semiconductor device to internal buses of the semiconductor device,
- establishing redundant connections between the buses and the external contacts;
- forming the buses in a first process layer;
- and
- forming the redundant connections in the same first process layer.
Dependencies are inferred from the claim text.