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US 2006/0033196 A1Published application
Package structure
AssigneeAdvanced Chip Engineering Technology Inc.
InventorsWen-Kun Yang, Shih-Li Chen, Wen-Bin Sun, Ming-Hui Lin, Chao-Nan Chou, Chih-Wei Lin
Life of this patent
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Abstract
A package structure including a device, an interconnecting element, a pad and a protecting element is provided. The device connects with a first end of the interconnecting element through the pad. The protecting element covers the pad and the first end of the interconnecting element.
Claims17
A package structure, comprising:
- a device;
- a pad connecting with said device at least an interconnecting element including a first end and a second end, wherein said first end connects with said pad;
- a connecting element connecting with said second end of said interconnecting element;
- and
- a protecting element covering said pad and said first end of said interconnecting element.
2 more elements
Dependencies are inferred from the claim text.