Methods and systems for attaching die in stacked-die packages
AssigneeIntel Corporation
InventorsRahul Manepalli, Shinobu Kourakata, Nina Ricci Buenaseda
Life of this patent
Estimating the term…
Abstract
A method for producing a multiple-die device by attaching a die to a substrate using a first die-attach material having a first processing temperature and attaching a subsequent die using a second die-attach material having a second processing temperature such that the process of attaching the second die does not degrade the first die-attach material. For one embodiment, multiple dies are attached using each die-attach material. For one embodiment, the first die-attach material is a thermoplastic film and the second and subsequent die-attach materials are reformulations of the thermoplastic film.
Claims30
An apparatus comprising:
- a substrate;
- a first die-attach material attaching a first die to the substrate, the first die-attach material having a first associated processing temperature;
- and
- a second die-attach material attaching a second die to the first die, the second die-attach material having a second associated processing temperature.
An apparatus comprising:
- a substrate;
- a first die-attach material;
- a first set of one or more dies attached to the substrate and to one another using the first die-attach material, the first die-attach material having a first associated processing temperature;
- and
- a corresponding subsequent set of one or more dies attached to a previous set of one or more die and to one another using one or more subsequent die-attach materials, each subsequent die-attach material, each subsequent die-attach material having a respective associated processing temperature such that each respective associated processing temperature is lower than the first associated processing temperature and each previous respective associated processing temperature.
A method comprising:
- selecting a first die-attach material having a first associated processing temperature;
- attaching a first set of one or more dies to a substrate and to one another using the first die-attach material;
- selecting a second die-attach material having a second associated processing temperature, the second associated processing temperature being lower than the first associated processing temperature such that subjecting the first die-attach material to the second associated processing temperature does not degrade the first die-attach material to within a specified degree;
- and
- attaching a second set of one or more dies to the first set of one or more dies and to one another using the second die-attach material.
A system comprising:
- a first die;
- a logic processor device implemented on the first die;
- one or more additional dies;
- one or more memory devices implemented on each of the one or more additional dies;
- a first die-attach material attaching the first die to a substrate, the first die-attach material having a first associated processing temperature;
- and
- one or more subsequent die-attach materials attaching a corresponding set of one or more of the additional dies to a previous die and to one another, each subsequent die-attach material having a respective associated processing temperature such that each respective associated processing temperature is lower than the first associated processing temperature and each previous respective associated processing temperature.
Dependencies are inferred from the claim text.