Structure and method of forming capped chips
AssigneeTessera, Inc.
InventorsBelgacem Haba, Masud Beroz, Glenn Urbish, David Tuckerman
Life of this patent
Estimating the term…
Abstract
As disclosed herein, structures and methods are provided for forming capped chips. As provided by the disclosed method, a metal base pattern is formed on a chip insulated from wiring of the chip, and a cap is formed including a metal. The cap is joined to the metal base pattern on the chip to form the capped chip. In one embodiment, a front surface of the chip is exposed which extends from a contact of the chip to an edge of the chip. In another embodiment, a conductive connection is formed to the contact, the conductive connection extending from the contact to a terminal at an exposed plane above the front surface of the chip.
Claims43
A method of forming a capped chip, comprising:
- forming a metal base pattern on a front surface of a chip;
- joining a cap including a metal to said metal base pattern on said chip to form a capped chip such that said front surface of said chip remains uncovered by said cap from at least a contact of said chip to a peripheral edge of said chip.
A method of forming a capped chip, comprising:
- providing a chip having a front surface, a rear surface, and peripheral edges extending between said front and rear surfaces, and a metal base pattern disposed on said front surface;
- joining a microelectronic substrate including a cap to said metal base pattern to form a capped chip such that a front surface of said microelectronic substrate faces said front surface of said chip and extends beyond at least one said peripheral edge, whereby a terminal of said microelectronic substrate is not covered by said chip.
A method of forming a capped chip, comprising:
- providing a cap including a dielectric panel having a first layer of metal on a first side thereof, a depression on a second side thereof and a second layer of metal over said depression on said second side;
- and
- joining said cap to a chip to form a capped chip, wherein said metal covered depression defines a cavity facing said chip.
A method of forming a plurality of capped chips, comprising:
- providing a plurality of chips arranged in an array, each chip having a front surface and a metal base pattern and a contact on said front surface;
- providing a cap frame including an array of caps, each including a metal;
- joining said array of caps to said metal base patterns of said plurality of chips to form capped chips, wherein a front surface of each said chip remains uncovered by the said cap joined thereto, from at least said contact of said chip to a peripheral edge of said chip.
A method of forming a plurality of capped chips, comprising:
- providing an array of chips, each said chip having a front surface, a rear surface, and peripheral edges extending between said front and rear surfaces, and a metal base pattern disposed on said front surface;
- joining an array of microelectronic substrates, each including a cap, to said metal base patterns to form an array of capped chips, such that a front surface of each said microelectronic substrate faces said front surface of each said chip and extends beyond at least one said peripheral edge.
A method of forming a capped chip, comprising:
- providing a chip having a front surface, and a metal base pattern and a contact on said front surface;
- providing a cap substrate having a top surface and a bottom surface, a cap metal on said top surface, and at least one conductive connector exposed at said top surface and said bottom surface;
- and
- simultaneously bonding said cap metal to said metal base pattern and said conductive connector to said contact to form a capped chip having said conductive connector exposed at said bottom surface of said cap substrate.
A capped chip, comprising:
- a chip having a front surface including wiring, a metal base pattern insulated from said wiring, and an active area, said front surface extending between a first edge of said chip and a second edge of said chip opposite said first edge;
- and
- a cap including a metal layer joined to said chip, wherein said front surface is exposed between a contact of said chip and at least said first edge of said chip.
A capped chip comprising:
- a chip having a metal base pattern on a front surface thereof;
- and
- a microelectronic substrate having a cap metal pattern joined to said metal base pattern, wherein said microelectronic substrate extends beyond at least one peripheral edge of said front surface of said chip, such that a front surface of said microelectronic substrate remains uncovered by said chip from at least a terminal to a peripheral edge of said microelectronic substrate.
A capped chip, comprising:
- a chip having a front surface, a metal base pattern and a contact on said front surface;
- a cap substrate having a top surface and a bottom surface, a cap metal on said top surface, and at least one conductive connector exposed at said top surface and said bottom surface,
- said cap metal bonded to said metal base pattern and said conductive connector bonded to said contact such that said conductive connector is exposed at said bottom surface of said cap substrate.
Dependencies are inferred from the claim text.