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US 2006/0033182 A1Published application
Method of fabricating a 3D RRAM
AssigneeSharp Laboratories of America, Inc.
InventorSheng Hsu
Life of this patent
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Abstract
A memory array layer for use in a 3D RRAM is formed, with peripheral circuitry, on a silicon substrate; layers of silicon oxide, bottom electrode material, silicon oxide, resistor material, silicon oxide, silicon nitride, silicon oxide, top electrode and covering oxide are deposited and formed. Multiple memory array layers may be formed on top of one another. The RRAM of the invention may be programmed in a single step or a two step programming process.
Claims5
1-3. (canceled)
A method of programming a 3D RRAM comprising:
- selecting a memory cell to be written to;
- applying a high voltage programming pulse to a first related bit line;
- applying a low voltage programming pulse to a second related bit line;
- floating the associated word line;
- Biasing all other word lines with half-programming pulse voltages;
- and
- biasing all non-selected bit lines to the ground potential.
4 more elements
A method of programming a 3D RRAM comprising:
- selecting a memory cell to be written to;
- applying a low voltage programming pulse to a first memory resistor in the memory cell;
- applying a high voltage programming pulse to a second memory resistor in the memory cell;
- setting the selected word line to ground potential;
- biasing all other word lines are biased to 0.5 VP;
- biasing a first related bit line with a negative programming pulse, having a pulse amplitude of −VP;
- biasing a second related bit line with a positive programming pulse, having amplitude of +VP;
- and
- pulsing all non-selected memory resistors with a programming voltage of between 0VP and 0.5 VP.
6 more elements
Dependencies are inferred from the claim text.