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US 2006/0033172 A1Published application
Metal-metal bonding of compliant interconnect
AssigneeIntel Corporation
InventorsSriram Muthukumar, Shriram Ramanathan
Life of this patent
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Abstract
Embodiments of the invention provide a first component with a compliant interconnect bonded to a second component with a land pad by a metal to metal bond. In some embodiments, the first component may be a microprocessor die and the second component a package substrate.
Claims28
A device, comprising:
- a first component with a compliant interconnect;
- a second component with a bond pad;
- and
- wherein the bond pad is bonded to the compliant interconnect without solder.
1 more element
A device, comprising:
- a microprocessor die having a first surface and a compliant interconnect structure extending from the first surface, the compliant interconnect having:
- a fixed portion adjacent the first surface;
- a compliant portion extending from the fixed portion and separated from the first surface by a gap;
- and
- a package substrate having a bond pad;
- and
- wherein the compliant portion is directly bonded to the bond pad.
4 more elements
A method, comprising:
- forming a compliant interconnect on a die, the compliant interconnect having an external layer furthest from the die;
- positioning the die so the external layer of the compliant interconnect contacts a bond pad on a package substrate;
- and
- forming a metal to metal bond between the external layer and the bond pad.
1 more element
A method, comprising:
- positioning a compliant interconnect with a spring portion to bring a first metal portion of the spring portion in contact with a second metal portion of a bond pad, the first and second metal portions being separate pieces of metal with a boundary;
- and
- forming a single substantially uniform metal portion from the first metal portion and the second metal portion without melting the first or second metal portions.
Dependencies are inferred from the claim text.