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US 2006/0032894 A1Published application
Wire bond with improved shear strength
AssigneeAsm Technology Singapore Pte Ltd
InventorYam Wong
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Abstract
A wire bonding method and a wire bond formed from the method are provided to improve shear strength of a wire that is connected to a bonding surface. The wire bond includes a bonded wire having a base in contact with the bonding surface, a recessed portion formed substantially at an edge of the bonded wire wherein at least a portion of an underside of the recessed portion is in contact with the bonding surface, and a length of wire extending from the recessed portion.
Claims19
Method for bonding a wire to a bonding surface with a bonding tool, comprising the steps of:
- contacting the bonding surface with the wire at a bonding location;
- applying bonding energy from the bonding tool to attach the wire to the bonding surface at a bonding point lying along a central longitudinal axis of the bonding tool;
- moving the bonding tool away from the bonding location;
- contacting the attached wire with the bonding tool at an offset position where the central longitudinal axis of the bonding tool is offset from the bonding point;
- then
- applying bonding force and power to deform the attached wire until an underside of the deformation not already in contact with the bonding surface contacts the bonding surface.
3 more elements
A wire bond comprising:
- a bonded wire having a base in contact with a bonding surface;
- a recessed portion substantially at an edge of the bonded wire wherein at least a portion of an underside of the recessed portion is in contact with the bonding surface;
- and
- a length of wire extending from the recessed portion.
1 more element
Dependencies are inferred from the claim text.