Burn-in apparatus
AssigneeEspec Corp.
InventorsKazuhiro Nakamura, Tetsuya Shimada, Katsuhiko Watabe
Life of this patent
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Abstract
The burn-in apparatus includes a water supply system and a sprayer and has a structure such that water is converted into mist and sprayed onto the upper surface of a device attached to a socket of a burn-in board. The amount of heat generated by the device that generates high heat is removed by the amount of heat that includes a large latent heat from when the mist falls on the upper surface and is evaporated. Burn-in of the device is conducted while it is being cooled to the target temperature.
Claims6
A burn-in apparatus for cooling a semiconductor device to a burn-in temperature;
- said semiconductor device including a first surface, said first surface being planar, said semiconductor device passing electric current therethrough and generating heat so that a temperature thereof rises above said burn-in temperature and a temperature of said first surface rises;
- said apparatus comprising:
- liquid supply means for pressurizing and supplying liquid that cools said semiconductor device, said liquid having a saturation temperature that is lower than said temperature of said first surface when said temperature of said first surface rises;
- and
- liquid discharge means for supplying, discharging at a reduced pressure and atomizing said liquid so that said liquid reaches said first surface.
A burn-in apparatus for cooling a semiconductor device to a burn-in temperature;
- said semiconductor device including a first surface, said first surface being planar, said semiconductor device passing electric current therethrough and
- generating heat so that a temperature thereof rises above said burn-in temperature and a temperature of said first surface rises;
- said apparatus comprising:
- liquid supply means for pressurizing and supplying liquid that cools said semiconductor device, said liquid having a saturation temperature that is lower than said temperature of said first surface when said temperature of said first surface rises;
- and
- a separation member that is pressable against said first surface so that said separation member covers said first surface and transfers heat from said first surface, said separation member being separable from said first surface;
- and
- liquid discharge means for supplying, discharging at a reduced pressure and atomizing said liquid so that said liquid reaches a surface opposite to said first surface on said separation member.
Dependencies are inferred from the claim text.