Micro-chimney and thermosiphon die-level cooling
AssigneeIntel Corporation
InventorsGregory Chrysler, James Maveety
Life of this patent
Estimating the term…
Abstract
A method and arrangement for dissipating heat from a localized area within a semiconductor die is presented. A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area. As such, thermal stress on the die is reduced, and total heat from the die is more readily dissipated.
Claims30
A method for dissipating heat from a localized area within a semiconductor die, the method comprising:
- providing a semiconductor die constructed and arranged to have at least one conduit portion therein, at least a portion of the conduit portion being proximate to the localized area, the conduit portion being at least partially filled with a heat-dissipating material;
- absorbing, by the conduit portion, heat from the localized area;
- and dissipating, by the conduit portion, at least a portion of the heat away from the localized area.
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An arrangement for dissipating heat from a localized area within a semiconductor die, comprising;
- a semiconductor die having at least one conduit portion, at least a portion of the conduit portion being proximate to the localized area;
- and
- a heat-dissipating material at least partially filling the conduit portion,
- wherein the conduit portion is constructed and arranged to absorb heat from the localized area and to dissipate at least a portion of the heat away from the localized area.
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Dependencies are inferred from the claim text.