Micro-electromechanical structure with improved insensitivity to thermomechanical stresses induced by the package

A micro-electromechanical device, comprising:

• a semiconductor material substrate including a central anchoring region;
• a rotor anchor coupled to the substrate at the central anchoring region;
• a stator anchor coupled to the substrate at the central anchoring region;
• a rotor lying in a spaced-apart relationship with respect to a surface of the substrate and movably coupled to the substrate by a plurality of spring elements extending between the rotor and the rotor anchor, the rotor element being sized and positioned to surround the rotor and stator anchors;
• and
• a stator lying in a spaced-apart relationship with respect to a surface of the substrate and coupled to the substrate by the stator anchor.

A device comprising:

• a semiconductor substrate;
• a rotor anchor coupled to the substrate;
• a rotor movably coupled to the rotor anchor and having a plurality of rotor electrodes;
• a plurality of stator anchors coupled to the substrate substantially equidistant from the rotor anchor;
• a stator coupled to the plurality of stator anchors and having a plurality of stator electrodes;
• and
• means for reducing sensitivity of the device to dilatation thereof.