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US 2006/0032147 A1Published application
Method of preparing slurry composition for chemical mechanical polishing
OwnerJae-hyun So, Dong-jun Lee +4inventors
InventorsJae-hyun So, Dong-jun Lee, Nam-soo Kim, Sung-taek Moon, Bong-su Ahn, Kyoung-moon Kang
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Abstract
A method of preparing polishing particles by baking unmilled cerium compound in an environment having a temperature in a range between about 400-700° C., and without dropping the temperature in the environment, applying thermal stress to the resultant cerium oxide in-situ by heating the environment to a temperature in a range between about 700-800° C. to obtain cerium oxide particles.
Claims20
A method of preparing polishing particles, comprising:
- baking unmilled cerium compound in an environment having a temperature in a range between about 400-700° C.;
- and
- without dropping the temperature in the environment, applying thermal stress to the resultant cerium oxide in-situ by heating the environment to a temperature in a range between about 700-800° C. to obtain cerium oxide particles.
A method of preparing a slurry composition used for chemical mechanical polishing (CMP), comprising:
- baking cerium compound in an environment having a temperature in a range between about 400-700° C.;
- without dropping the temperature in the environment, applying thermal stress to the resultant cerium oxide in-situ by heating the environment to a second temperature in a range between about 700-800° C. to obtain cerium oxide particles;
- dispersing the cerium oxide particles in deionized water to obtain a cerium oxide dispersion;
- and
- mixing the cerium oxide dispersion, deionized water, and an additive composition to obtain a cerium oxide slurry.
2 more elements
Dependencies are inferred from the claim text.