Circuit device manufacturing method

A circuit device manufacturing method comprising:

• preparing an insulating sheet that includes a first conductive wiring layer and conductive film that are laminated with interlayer insulating layer interposed therebetween, multilayer connection means connecting the first conductive wiring layer and the conductive film at a desirable portion by penetrating the interlayer insulating layer, and an overcoat resin that covers the first conductive wiring layer selectively;
• affixing a circuit element on the overcoat resin and electrically connecting the circuit element to the first conductive wiring layer;
• irradiating plasma onto the overcoat resin and the first conductive wiring layer, including the circuit element;
• and
• forming a resin layer so as to cover the circuit element.

A circuit device comprising

• a first conductive wiring layer and conductive film that are laminated with interlayer insulating layer interposed therebetween;
• multilayer connection means connecting the first conductive wiring layer and the conductive film at a desirable portion by penetrating the interlayer insulating layer;
• an overcoat resin that covers the first conductive wiring layer selectively;
• a circuit element which is affixed on the overcoat resin;
• a resin layer that covers the circuit element;
• wherein fine irregularity is formed by irradiating plasma to roughen top surfaces of the circuit element, the overcoat resin and the first conductive wiring layer.

A circuit device comprising

• a first conductive wiring layer and a second conductive wiring layer that are laminated with interlayer insulating layer interposed therebetween;
• multilayer connection means connecting the first conductive wiring layer and the conductive film at a desirable portion by penetrating the interlayer insulating layer;
• an overcoat resin that covers the first conductive wiring layer selectively;
• a circuit element which is affixed on the overcoat resin;
• a resin layer that covers the circuit element;
• wherein fine irregularity is formed by irradiating plasma to roughen top surfaces of the circuit element, the overcoat resin and the first conductive wiring layer.