Linear via punch

A process for punching and filling vias in a substrate comprising the steps of:

• a) fabricating a die having a full array die pattern corresponding to a via fill mask,
• b) placing the substrate on the die,
• c) fabricating a punch head having a fixed pattern corresponding to a portion of the via fill mask,
• d) positioning the substrate and the die at a position below the punch head,
• e) punching at least one via in the substrate corresponding to the die pattern of the die,
• f) stepping the substrate and the die to a further position below the punch head, and
• g) repeating steps e) and f) until the die pattern is complete.

A process for punching and filling vias in a substrate comprising the steps of:

• a) fabricating a die having a full array die pattern corresponding to a via fill mask,
• b) placing the substrate on the die,
• c) detachably fixing the substrate to the die,
• d) fabricating a punch head having a fixed pattern corresponding to a portion of the via fill mask,
• e) positioning the substrate and the die at a position below the punch head,
• f) aligning the substrate and the die with the punch head,
• g) punching at least one via in the substrate corresponding to the die pattern of the die,
• h) stepping the substrate and the die to a further position below the punch head, and,
• i) repeating steps f), g), and h) until the die pattern is complete.

A process for punching and filling vias in a substrate comprising the steps of

• a) fabricating a die having a full array die pattern corresponding to a via fill mask,
• b) placing the substrate on the die,
• c) detachably fixing the substrate to the die,
• d) fabricating a punch head having a fixed pattern corresponding to a portion of the via fill mask,
• e) positioning the substrate and the die at a position below the punch head,
• f) aligning the substrate and the die with the punch bead,
• g) placing the punch head in contact with a top surface of the substrate,
• h) Articulating the punch head in at least one of an x position, a y position, and a theta position with respect to said die,
• i) punching at least one via in the substrate corresponding to the die pattern of the die,
• j) stepping the substrate and the die to a further position below the punch head, and
• l) repeating steps f) through j) until the die pattern is complete.

An tool for punching holes in a substrate comprising:

• a punch head having a fixed partial pattern,
• a die having a full array pattern with a portion corresponding to said fixed partial pattern and adapted to support said substrate wherein said substrate is disposed between said punch head and said die such that said punch head is disposed above said substrate, said punch head punching holes in said substrate in a pattern which corresponds to said die array pattern, and
• alignment means for aligning said punch head with said die, said alignment means having at least one alignment pin on said punch head and at least one locator hole in said die,
• wherein said punch head articulates in at least one of an x position, y position, and a theta position with respect to said die.