Method and apparatus for solder-less attachment of an electronic device to a textile circuit

An electrical circuit connection, comprising:

• a carrier that is able to be sewn through by stitching;
• at least one connection areas, each of the at least one connection areas in mechanical contact with the carrier;
• a textile material;
• at least one interwoven conductive thread that is a part of the textile material;
• and
• at least one conductive stitching, each of the at least one conductive stitching comprising a conductive material and being woven through the carrier and the textile material so as to form an electrical connection between one of the at least one connection areas and one of the at least one interwoven conductive thread.

A method for connecting two electrical circuits, the method comprising:

• providing a carrier that is able to be sewn through, the carrier having at least one connection areas, each of the at least one connection areas in mechanical contact with the carrier;
• placing the carrier in proximity to a textile material, the textile material having at least one interwoven conductive thread attached to the textile material;
• and
• passing at least one conductive stitching through the carrier and the textile material so as to form an electrical coupling between one of the at least one connection areas and one of the at least one interwoven conductive thread, wherein each of the at least one conductive stitching comprises a conductive material.