Chemical treatment of material surfaces
OwnerPei-l Wang, Toh-Ming Lu +2inventors
InventorsPei-l Wang, Toh-Ming Lu, Shyam Murarka, Ramkrishna Ghoshal
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OwnerPei-l Wang, Toh-Ming Lu +2inventors
InventorsPei-l Wang, Toh-Ming Lu, Shyam Murarka, Ramkrishna Ghoshal
Estimating the term…
A method for treating the surfaces of materials to improve wettability and adhesion of subsequently deposited polymer layers is disclosed. Suitable materials for practice of the method include polymeric materials and silicon-containing materials is disclosed. The method involves contacting at least a portion of the surface of the material with an aqueous solution of sulfuric acid or phosphoric acid, followed by rinsing with water. After the acid treatment, the contact angle of the surface decreases, and subsequently deposited polymer coatings easily wet the material's surface and exhibit enhanced adhesion. The method may be used to fabricate useful structures, such as semiconductor structures, optical waveguide structures, and coated articles.
A method of treating at least a portion of the surface of a material comprising contacting said at least a portion of the surface of said material with an aqueous solution of sulfuric acid or phosphoric acid, wherein said material is selected from the group of polymeric materials and silicon-containing materials.
A method of fabricating a useful structure comprising:
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A method of fabricating a semiconductor structure comprising:
Dependencies are inferred from the claim text.