Apparatus for depositing a multilayer coating on discrete sheets

A device for depositing material onto a discrete substrate, said device comprising:

• a cluster tool configured to deposit one at least one inorganic layer onto said substrate;
• an in-line tool configured to deposit one at least one organic layer onto said substrate, said in-line tool operatively coupled to said cluster tool;
• and
• a reduced-pressure source placed in vacuum communication with at least said in-line tool such that during at least a portion of deposition of said organic layer onto said discrete substrate, said reduced-pressure source operates to create an at least partially evacuated environment about said substrate.

A tool for depositing a multilayer coating on a discrete substrate, said tool comprising:

• a plurality of peripheral stations disposed about a substantially central hub and coupled thereto such that said substantially central hub can transport said substrate between at least one of said peripheral stations, said plurality of peripheral stations comprising:
• a barrier layer forming station configured to deposit one at least one inorganic layer onto said substrate;
• and
• at least one organic layer forming station configured as an in-line tool to deposit one at least one organic layer onto said substrate;
• a reduced-pressure source placed in vacuum communication with at least one of said barrier layer forming station and said organic layer forming station such that during at least a portion of deposition of said multilayer coating onto said substrate, said reduced-pressure source operates to create an at least partially evacuated environment about said substrate;
• and
• a temperature control device placed in thermal communication with at least one of said barrier layer forming station and said organic layer forming station such that during at least a portion of deposition of said multilayer coating onto said substrate, said temperature control device operates to adjust the temperature of said substrate.

A tool for depositing a multilayer coating on a discrete substrate, said tool comprising:

• a monomer layer deposition station configured as an in-line tool to deposit one at least one organic layer onto said substrate, said in-line tool operatively coupled to said cluster tool;
• a barrier layer deposition station cooperative with said monomer layer deposition station, said barrier layer deposition station configured as a cluster tool to deposit one at least one inorganic layer onto said substrate;
• and
• a reduced-pressure source placed in vacuum communication with said at least one of said cluster tool and said in-line tool such that during at least a portion of deposition of said multilayer coating onto said discrete substrate, said reduced-pressure source operates to create an at least partially evacuated environment about said substrate.

An encapsulating tool configured to deposit a multilayer coating onto an organic light emitting diode placed on a discrete substrate, said encapsulating tool comprising:

• a cluster tool configured to deposit one at least one inorganic layer onto said organic light emitting diode;
• an in-line tool configured to deposit one at least one organic layer onto said organic light emitting diode, said in-line tool operatively coupled to said cluster tool;
• and
• a vacuum source coupled to at least said in-line tool such that during at least a portion of deposition of said organic layer onto said organic light emitting diode, said vacuum source operates to create an at least partially evacuated environment about said organic light emitting diode.

A method of depositing a multilayer coating onto a substrate, said method comprising:

• configuring a tool to comprise:
• a cluster section configured to deposit one at least one inorganic layer onto said substrate;
• an in-line section configured to deposit one at least one organic layer onto said substrate, said in-line section operatively coupled to said cluster section;
• and
• a reduced-pressure source placed in vacuum communication with at least said in-line section;
• loading said substrate into said tool;
• depositing at least a portion of said inorganic material onto said substrate as a component of said multilayer coating;
• operating said reduced-pressure source to create an at least partially evacuated environment about said substrate during at least a portion of deposition of said organic layer onto said substrate;
• depositing at least a portion of said organic layer onto said substrate as a component of said multilayer coating;
• and
• curing said deposited organic layer.

A method of encapsulating an organic light emitting diode placed on a discrete substrate with a multilayer coating, said method comprising:

• configuring an encapsulation tool to comprise:
• a cluster section configured to deposit one at least one inorganic layer onto said organic light emitting diode;
• an in-line section configured to deposit one at least one organic layer onto said organic light emitting diode, said in-line section operatively coupled to said cluster section;
• and
• a vacuum source coupled to at least said in-line section;
• loading said organic light emitting diode into said encapsulation tool;
• depositing at least a portion of said inorganic layer onto said organic light emitting diode while said organic light emitting diode is in said inorganic layer deposition station;
• depositing at least a portion of said organic layer onto said organic light emitting diode while said organic light emitting diode is in said organic layer deposition station;
• operating said vacuum source to create an at least partially evacuated environment about said organic light emitting diode during at least a portion of deposition of said organic layer thereon;
• and
• curing said deposited organic layer.

A tool comprising:

• an encapsulation device comprising:
• an organic layer forming station comprising:
• an organic material deposition station;
• an organic material curing station cooperative with said organic material deposition station;
• a substrate-transport configured to convey a substrate between at least said organic material deposition station and said organic material curing station;
• a reduced-pressure source placed in vacuum communication with said organic material deposition station such that during at least a portion of deposition of an organic layer onto said discrete substrate, said reduced-pressure source operates to create an at least partially evacuated environment about said substrate;
• and
• a thermal control mechanism cooperative with at least one of said organic material deposition station and organic material curing station such that a temperature therein can be controlled during formation of said organic material on said substrate;
• and
• a barrier layer forming station configured to place at least one inorganic layer onto said substrate or said organic layer formed on said substrate, said barrier layer forming station and said organic layer forming station cooperative with one another such that upon operation thereof at least one encapsulated member is formed on said substrate;
• a load lock to facilitate selective vacuum isolation between said encapsulation device and a remainder of said tool;
• and
• an exchange mechanism to facilitate transport of said at least one encapsulated member between said encapsulation device and said remainder of said tool.