Device for etching semicnductors with a large surface area

A device for etching large surface area semiconductor wafers in an etching trough containing a liquid electrolyte, the device comprising:

• a) at least one sample head mounted within the etching trough;
• b) means within the sample head for holding the semiconductor wafer with an etching surface facing downwards;
• c) means without the use of pumps for causing movement of the electrolyte mounted below the etching trough;
• d) at least two replaceable spacers mounted on opposite end portions of the sample head to maintain a designated space between the etching surface and the etching trough;
• and
• e) electrical contacts mounted on the sample head for electrochemical etching.

A method for etching large surface area semiconductor wafers in an etching trough containing a liquid electrolyte, the steps comprising:

• a) mounting a sample head within the etching trough;
• b) providing a means for holding the semiconductor wafer with an etching surface facing downwards within the sample head;
• c) setting a spacing between the semiconductor wafer etching surface and the etching trough bottom using spacers;
• and
• d) providing a tilting movement of the etching trough to cause a turbulent flow of the electrolyte liquid.