Bump forming method and system using bump material including liquid

Abstract

A bump forming method for forming bumps on pads of a test piece which is a semiconductor wafer or chip includes a fastening process of pouring a bump material including liquid toward a target face of a mask substrate in which a plurality of holding holes are provided, and making bump materials, included in the bump material including liquid, be fastened to the holding holes; a removing process of removing bump materials remaining on the target face of the mask substrate; and a compression process of compressing the pads of the test piece from the side of the target face of the mask substrate toward the mask substrate so as to bond the bump materials onto the pads. Micro bump materials can be accurately attached onto pads on a silicon wafer, or the like, and the size of the mask substrate can be easily increased.

Dependencies are inferred from the claim text.