Method for releasing stress of embedded chip and chip embedded structure
AssigneePhoenix Precision Technology Corporation
InventorsChu-Chin Hu, Chung-Cheng Lien, Chi-Ming Chen, Sheng-Hsiang Yang, Meng-Da Chou
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Abstract
A method for releasing stress of an embedded chip and a chip embedded structure are proposed. Cutting processes are performed to a semiconductor chip before it is embedded in a circuit board to form cut-way portions at edges of the chip so as to allow stress to be released when the chip is subsequently embedded in the circuit board and a filler material is filled between the chip and the circuit board.
Claims16
A method for releasing stress of an embedded chip, comprising the steps of:
- providing a wafer comprising a plurality of semiconductor chips, the wafer having an active surface and a non-active surface opposite to the active surface;
- performing a semi-cutting process at boundaries between the adjacent chips on the active surface of the wafer to form a plurality of grooves;
- and
- performing a full-cutting process at the grooves to separate the plurality of chips from each other, such that each of the separated chips is formed with cut-away portions at edges of its active surface to allow stress concentrated on the chip to be reduced when the chip is embedded in a circuit board.
A method for releasing stress of an embedded chip, comprising the steps of:
- providing a wafer comprising a plurality of semiconductor chips, the wafer having an active surface and a non-active surface opposite to the active surface;
- performing a semi-cutting process at boundaries between the adjacent chips on the active surface of the wafer to form a plurality of grooves;
- and
- performing a full-cutting process on the non-active surface of the wafer to separate the plurality of chips from each other in a manner that each of the separated chips is formed with cut-away portions at edges of its active and non-active surfaces to allow stress concentrated on the chip to be reduced when the chip is embedded in a circuit board.
A chip embedded structure, comprising:
- a support board having at least one opening;
- and
- at least one semiconductor chip received in the opening, wherein the chip is formed with cut-away portions at its edges to allow stress concentrated on the chip to be reduced when a filler material is filled between the chip and the support board.
Dependencies are inferred from the claim text.