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US 2005/0239237 A1Published application
Method for producing a BGA chip module and BGA chip module
AssigneeInfineon Technologies AG
InventorsFrank Puschner, Wolfgang Schindler, Gunter Tutsch
Life of this patent
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Abstract
BGA chip module and method for producing the BGA chip module by providing a carrier, forming holes at points at which bonding points of the BGA chip module are to be produced, forming metallization areas on an upper side of the carrier and covering the holes, connecting bonding points of a chip to the metallization areas, and introducing bonding elements into the holes.
Claims32
A method for producing a BGA chip module comprising the steps of:
- providing a carrier;
- forming holes at points at which bonding points of the BGA chip module are to be produced;
- forming metallization areas on an upper side of the carrier and covering the holes;
- connecting bonding points of a chip to the metallization areas;
- and
- introducing bonding elements into the holes.
3 more elements
A BGA chip module comprising:
- a carrier having through-holes;
- a chip arranged on an upper side of the carrier;
- bonding points arranged on the underside of the carrier;
- metallization areas covering the through-holes on the upper side of the carrier and being electrically connected to bonding points;
- and
- bonding elements accommodated in the through-holes.
3 more elements
A BGA chip module comprising:
- a carrier;
- holes formed at points at which bonding points of the BGA chip module are to be produced;
- metallization areas formed on an upper side of the carrier and covering the holes;
- means for connecting a chip to the metallization areas;
- and
- second bonding means accommodated in the holes.
3 more elements
Dependencies are inferred from the claim text.