Printed circuit board and fabrication method thereof
AssigneeSony Corporation
InventorYoichi Oya
Life of this patent
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Abstract
The present invention provides a printed circuit board which is capable of air-tightly sealing a functional surface of a device and of preventing excessive stress from acting on the device itself or a conductive bump conjugating the device with a wiring board and a method of fabricating the printed circuit board. The printed circuit board has a device mounted in a hollow formed in a wiring board via a plurality of conductive bumps. In the printed circuit board, a gap is formed between a functional surface of the device and an inner surface of the hollow, and a sealing member is disposed around side surfaces of the device so as to air-tightly isolate the gap and a space within the hollow excepting the gap.
Claims5
1-4. (canceled)
A method of fabricating a printed circuit board in which a device is mounted in a cavity formed in a wiring board via a plurality of conductive bumps and a gap is formed between a functional surface of said device and an inner surface of said cavity, said method comprising the step of forming a sealing member around side surfaces of said device so as to air-tightly isolate said gap and a space within said cavity other than the gap.
Dependencies are inferred from the claim text.