Method for manufacturing an adhesive substrate with a die-cavity sidewall
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsBernd Appelt, Ching-Hua Tsao
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Abstract
A method for manufacturing an adhesive substrate with a die-cavity sidewall is disclosed. A region for forming die-cavity sidewall is defined on one surface of the substrate. The substrate is laminated with a sacrificial film, a partially cured resin is formed between the substrate and the sacrificial film. And then, an aperture is routed through the substrate, the partially cured resin, and the sacrificial film. The aperture is located corresponding to the region so that the substrate has a die-cavity sidewall formed inside the aperture. Thereafter, the sacrificial film is removed to expose the partially cured resin on the substrate so that the substrate with a die-cavity sidewall can have good adhesion.
Claims38
A method for manufacturing an adhesive substrate with a die-cavity sidewall, comprising:
- providing a first substrate, the first substrate having a surface defining at least a region for forming the die-cavity sidewall;
- laminating the first substrate with a sacrificial film, a partially cured resin being formed between the first substrate and the sacrificial film;
- forming an aperture located corresponding to the region of the first substrate, the aperture passing through the first substrate, the partially cured resin and the sacrificial film in a manner that the first substrate has the die-cavity sidewall inside the aperture;
- and
- removing the sacrificial film to expose the partially cured resin on the first substrate.
A method for manufacturing a semiconductor device, comprising:
- providing a first substrate, the first substrate having a surface defining at least a region for forming a die-cavity sidewall;
- laminating the first substrate with a sacrificial film, a partially cured resin being formed between the first substrate and the sacrificial film;
- forming an aperture located corresponding to the region, the aperture passing through the substrate, the partially cured resin and the sacrificial film in a manner that the first substrate has a die-cavity sidewall inside the aperture;
- removing the sacrificial film to expose the partially cured resin on the substrate;
- adhering the partially cured resin on the first substrate to a second substrate with a die-attached plane to form a die cavity;
- attaching a semiconductor chip to the die-attached plane of the second substrate;
- and
- electrically connecting the semiconductor chip and the first substrate.
An adhesive substrate with a die-cavity sidewall, comprising:
- a first substrate, the first substrate having a surface defining at least a region for forming the die-cavity sidewall;
- a partially cured resin formed on the surface of the first substrate;
- and
- a die-cavity sidewall formed corresponding to the region of the first substrate by forming an aperture passing through the first substrate and the partially cured resin.
Dependencies are inferred from the claim text.