Method for making a microelectromechanical system using a flexure protection layer
AssigneeHewlett-Packard Development Company, L.P.
InventorsJames Przybyla, Arthur Piehl
Life of this patent
Estimating the term…
Abstract
A microelectromechanical system is made by establishing a flexure protection layer over a portion of at least one flexure which is located on a substrate. The flexure protection layer is deposited such that a portion of the flexure is left exposed. Contact is established between a flexure-engaging element and the exposed portion of the flexure. The remaining flexure protection layer is removed after the flexure-engaging element is patterned and etched.
Claims41
A method of making a microelectromechanical system, comprising the steps of:
- establishing a flexure protection layer over at least a portion of a flexure located on a substrate such that at least a portion of the flexure is exposed;
- establishing contact between at least one flexure-engaging element and the exposed portion of the flexure;
- and
- removing the flexure protection layer subsequent to at least one of patterning and etching the flexure-engaging element.
A method of making a microelectromechanical system device, comprising the steps of:
- patterning a portion of a flexure having a flexure protection layer deposited thereon, the flexure located on a substrate and supported by a sacrificial layer positioned between the substrate and the flexure, wherein patterning of the flexure and the flexure protection layer occur simultaneously;
- etching a portion of the flexure and the flexure protection layer subsequent to the patterning step;
- removing a portion of the flexure protection layer from the flexure such that a portion of the flexure is exposed;
- depositing a flexure-engaging element over the sacrificial layer and in contact with the exposed portion of the flexure;
- configuring the flexure-engaging element;
- and then removing the flexure protection layer and the sacrificial layer.
A microelectromechanical system subassembly comprising:
- a substrate;
- means for suspending a flexure-engaging element relative to the substrate;
- and
- means for protecting the suspending means during the formation of the micromechanical system.
A microelectromechanical system comprising:
- a substrate;
- at least one flexure supported on the substrate, the flexure connected to at least one post projecting from the substrate, the flexure having a region distal to the post;
- at least one flexure-engaging element supported above the substrate and connected to the flexure at the region distal to the post, wherein the flexure exhibits essentially uniform thickness in the distal region and in regions proximate to the post.
A spatial light modulator, comprising:
- a substrate;
- a microelectromechanical system device including at least one flexure and at least one flexure-engaging element suspended above the substrate and connected to the flexure, the flexure having an essentially uniform thickness and a surface characterized by minimal evidence of etch artifacts.
A display device, comprising:
- a light source for providing a beam of light along a light path;
- a microelectromechanical system device on the light path for selectively reflecting a portion of the beam of light along a second light path in response to image data signals;
- a controller for providing image data signals to the microelectromechanical system device;
- and
- the microelectromechanical system device disposed on a substrate and at least one flexure connected to the substrate and at least one flexure-engaging element suspended above the substrate and connected to the flexure, wherein the flexure has a thickness sufficient to provide a spring constant between 14 Newton/meter and 1-8 Newton/meter and at least one surface region characterized by minimal etch artifacts.
An integrated circuit, comprising:
- a semiconductor substrate;
- a microelectromechanical system including at least one flexure connected to the semiconductor substrate and at least one flexure-engaging element connected to the flexure and suspended above the semiconductor substrate wherein the flexure is characterized by a thickness sufficient to provide a spring constant between 1−4 Newton/meter and 1−8 Newton/meter and at least one surface region having minimal etch artifacts.
Dependencies are inferred from the claim text.