Light emitting diode component
AssigneeGELcore, LLC
InventorsSrinath Aanegola, James Petroski, Emil Radkov, Stanton Weaver
Life of this patent
Estimating the term…
Abstract
A light emitting package (8, 8′, 8″, 208, 408) includes a printed circuit board (10, 10′, 10″, 210, 410) supporting at least one light emitting die (12, 12″, 14, 16, 212, 412). A light transmissive cover (60, 60′, 60″, 260, 460) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter (62, 62′, 62″, 262, 462) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume (70, 70″, 270, 470) containing the at least one light emitting die. An encapsulant (76, 76″, 276, 278, 476) is disposed in the interior volume and covers at least the light emitting die.
Claims54
A light emitting package comprising:
- a printed circuit board supporting at least one light emitting die and having at least two electrical terminals, printed circuitry of the printed circuit board connecting the at least one light emitting die with the at least two electrical terminals to provide power thereto;
- a light transmissive cover disposed over the at least one light emitting die but not over the at least two electrical terminals, the cover having an open end defining a cover perimeter connected with the printed circuit board, an inside surface of the cover together with the printed circuit board defining an interior volume containing the at least one light emitting die;
- and
- an encapsulant disposed in the interior volume and covering at least the light emitting die.
A light emitting package comprising:
- at least one light emitting die;
- a support on which the at least one light emitting die is disposed;
- a glass cover disposed on the support over the at least one light emitting die, the glass cover and the support cooperatively defining an interior volume containing the at least one light emitting die;
- and
- an encapsulant disposed in the interior volume and encapsulating the at least one light emitting die.
A light emitting package comprising:
- at least one light emitting die;
- a support on which the at least one light emitting die is disposed;
- a single-piece light transmissive cover disposed on the support over the at least one light emitting die, the single-piece cover and the support cooperatively defining a substantially closed interior volume containing the at least one light emitting die;
- and
- an encapsulant disposed in the interior volume and encapsulating the at least one light emitting die.
A method for making a light emitting package, the method comprising:
- electrically and mechanically connecting at least one light emitting die to a printed circuit board;
- securing a light transmissive cover to the printed circuit board, the light transmissive cover covering the at least one light emitting die, the secured light transmissive cover and the printed circuit board cooperatively defining an interior volume;
- and
- disposing an encapsulant in the interior volume.
A method for disposing of a phosphor on a surface, the method comprising:
- disposing an adhesive on the surface;
- applying a phosphor powder to the adhesive;
- and
- hardening the adhesive.
Dependencies are inferred from the claim text.