Method for grinding a bar of thin film magnetic elements utilizing a plurality of resistive films

A wafer comprising:

• a plurality of thin film magnetic elements each having a magnetoresistive sensor for reading a magnetic record from a recording medium and an inductive electromagnetic transducer for writing a magnetic record to the recording medium in a stacked structure;
• and
• first resistive films and second resistive films which are provided on a grind surface which emerges after the wafer is cut into a component in a predetermined shape;
• wherein the first resistive films are provided along a first longitudinal line parallel to a longitudinal direction of the component and the second resistive films are provided along a second longitudinal line parallel to the longitudinal direction of the component, and electric resistance values of the first and second resistive films vary as the grind surface is ground.

A device for grinding a elongate bar comprising:

• a rotatory grinding disc for grinding the bar, wherein the bar has a plurality of thin film magnetic elements aligned in a line, each of the thin film magnetic elements having a magnetoresistive sensor for reading a magnetic record from a recording medium and an inductive electromagnetic transducer for writing a magnetic record into the recording medium in a stacked structure, the surface of the bar being a grind surface so that it can be formed into an air-bearing surface by means of the grinding;
• a loading device for providing a press force to press the bar against the rotary grinding disc;
• and
• a plurality of load transmitting members provided on an opposite side to the grind surface of the bar, along two longitudinal lines parallel to a longitudinal direction of the bar and adapted to receive the press force generated by the loading device and press the bar against the grinding disc while directing the longitudinal direction of the bar in a radial direction of the grinding disc.